Whether you are looking for outsourcing the design and development of a high speed, high density multi-layer boards using high speed Microprocessors / DSPs / FPGAs or a low cost two layer, moderate speed micro-controller based board, Caravel is your right partner. Caravel has done both, cost effectively.
Caravel has experience and knowledge to design boards to meets various industry form factors, comply with various industry busses, and interface using various standard peripheral interconnects, various communication standards.
Caravel has put in place time tested design processes and systems to offer its customers complex board designs in the shortest possible time to enable them to take the product to the market faster.
Hardware & Board Designs
Comprehensive Board Design
Caravel utilizes time-tested design processes to offer customers complex board designs in the shortest possible time. Our expertise includes high-density BGA packages (up to 1152 pins) and multi-layer designs (up to 12 layers).
Design Services
- ✓ Architecture & Component Selection
- ✓ Schematic Capture & Board Layout
- ✓ Signal Integrity & EMI/EMC Analysis
- ✓ DFM / DFT Implementation
Post-Design Support
- ✓ Board Bring-up & Validation
- ✓ Prototyping & Pilot Production
- ✓ Manufacturing & Thermal Analysis
- ✓ Custom Test Jigs
Hardware Competencies
Detailed technical capabilities across various platforms and standards
Processors
Intel Pentium Centrino (855/965), PowerPC (MPC107), PowerQUICC family (MPC860).
Micro-controllers
8051, ARM7, PIC, ATMega, Motorola HC8/HC12, Hitachi family.
FPGA / CPLD
Xilinx, Altera, Cypress, Lattice. VHDL/Verilog expert, densities up to 1M gates.
Interfaces
UART (RS232/RS485/RS422), CAN, USB, Ethernet, Bluetooth, Zigbee, SPI, I2C, IDE, SATA, GPIB, Modem, IRDA, SCSI.
DSPs
TI DSPs
Memory
SDRAM, DDR/DDRII designs, Familiar with routing constraints
Interconnect busses
ISA, PCI, PC104, PCMCIA
Analog designs
Analog circuit designs for signal conditioning
ADC & DAC interface
Filter design, Mixed signal designs
Power supply design - SMPS, Linear, DC-DC Switchers, Battery charging and monitoring
PCB designs
Upto 12 layers
Board density with multiple BGA packages of size upto 1152 pins and other packages
PCB Size upto 20in X 12in
Milgrade boards with thermal dissipation layer